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Technology to bond metal semisphere diaphragm to rubber heat insulation layer(PDF)

《火箭推进》[ISSN:1672-9374/CN:CN 61-1436/V]

Issue:
2013年01期
Page:
46-51
Research Field:
工艺与材料
Publishing date:

Info

Title:
Technology to bond metal semisphere diaphragm to rubber heat insulation layer
Author(s):
LI Hong-chun;  JIANG Chao;  ZHU Feng
Xi’an Aerospace Propulsion Institute, Xi’an 710100, China
Keywords:
-
PACS:
TQ330.1-34
DOI:
-
Abstract:
The process to bond the TA1 hemisphere diaphragm to the rubber heat insulation layer is studied in this paper. The research mission in the aspects of selection of bonding solution, selection of heat insulation material, selection of adhesive, bonding test and experimental validation was performed. The results show that rubber 9621 can be used as the heat insulation material of TA1 semisphere diaphragm, and the rubber 9621 and TA1 hemisphere diaphragm can be bonded by epoxy adhesive DG-2. TA1 hemisphere diaphragm with heat insulation layer can tolerate the temperature≮500 K and the temperature rise inside the TA1 hemisphere diaphragm is almost zero within 240 s. The result shows that the heat insulation layer can preserve the liquid inside the metal hemisphere diaphragm to suffer from the disadvantageous effect of high temperature.

References:

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Memo

Memo:
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Last Update: 1900-01-01