航天推进技术研究院主办
YANG Zhan-zheng,ZHAI Hui-feng.Gold plating technology of metal seal[J].Journal of Rocket Propulsion,2013,39(06):60-64.
金属密封件镀金工艺研究
- Title:
- Gold plating technology of metal seal
- 文章编号:
- 1672-9374(2013)06-0060-05
- 分类号:
- V433.9-34
- 文献标志码:
- A
- 摘要:
- 介绍了金属密封件镀金工艺技术,该工艺采用亚硫酸盐镀金方案,以单脉冲电源为镀覆电源,以预镀镍层为中间镀层来制备金镀层,得到了结晶细致、厚度均匀并与基体上结合牢固的金镀层。研究了金镀层的沉积速率和结合强度,观察了镀层的表面形貌和组织结构,进行了金属密封件气密性试验和典型试验。结果表明: 金属密封件金镀层的技术性能指标满足设计要求,能够应用于液体火箭发动机中,该发动机已通过地面热试车考核。
- Abstract:
- The gold plating technology of gliding metal seal is introduced in this paper. The sulfite gold plating scheme is adopted in the technology. The gold plating layer with detailed crystal, uniform thickness and firm bonding was obtained by taking the single pulse power supply as the plating power supply, and the nickel pre-plating layer as an intermediate to prepare gold plating layer. The gold
参考文献/References:
[1]陈全寿. 再谈亚硫酸盐镀金[J]. 表面技术, 1998, 27(1): 46-48.
[2]李贤成. 无氰亚硫酸钠镀金工艺[J]. 电镀与涂饰, 2005, 24(9): 31-32.
[3]JEANMENNE R. Proper pertreatment for quality en plating[J]. Products Finishing, 1993, 58(2): 64-78.
[4]Subcommittee: B08.08. ASTM B656-91 standard guide for autocatalytic(electroless) nickel-phosphorus deposition on metals for engineering use[EB/OL]. [2000-01-01]. www.astm.org/Standards...656.htm.
[5]黄其殷, 白旭东, 李妙婷. 软金属密封结构密封性能数值仿真研究[J]. 火箭推进, 2012, 38(3): 29-33.
[6]王建武, 刘军生, 陈少斌. 球面型管路连接件密封性能分析及力学性能测试[J]. 火箭推进, 2010, 36(6): 36-41.
备注/Memo
收稿日期:2012-11-08;修回日期:2013-02-25
作者简介:杨战争(1979—),男,工程师,研究领域为表面工程及表面改性技术研究