航天推进技术研究院主办
ZHENG Liang,LI Liang,ZHANG Hua,et al.Study on ceramic blind hole processing method based on laser rotation cutting[J].Journal of Rocket Propulsion,2013,39(04):62-66.
基于激光旋切法的陶瓷材料盲孔加工方法研究
- Title:
- Study on ceramic blind hole processing method based on laser rotation cutting
- 文章编号:
- 1672-9374(2013)04-0062-05
- Keywords:
- laser drilling; rotation cutting; silicon carbide ceramic; blind hole
- 分类号:
- V261.8-34
- 文献标志码:
- A
- 摘要:
- 介绍了激光打孔的基本原理,对激光能量、离焦量、轨迹在激光旋切法加工盲孔过程中对孔形和表面质量的影响进行了分析和试验验证,并给出了一般规律。依据试验结果确定了合理工艺参数,采用旋切法在碳纤维增强碳化硅陶瓷基复合材料(Cf/SiC)上打出了孔径为1 mm,孔深为1.1 mm,锥度小于15°的盲孔。
- Abstract:
- The basic principle of laser drilling is introduced in this paper. The influence of laser energy, defocusing amount and trajectory during the ceramic blind hole processing on hole shape and surface quality was analyzed and verified in experiments. A general law is given. The rational process parameters were determined according to the test results. The rotation cutting was adopted to make the blind hole on Cf/SiC, whose diameter is 1 mm, depth is 1.1 mm and taper is less than 15°.
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备注/Memo
收稿日期:2013-01-06;修回日期:2013-04-19
作者简介:郑亮(1986—),助理工程师,研究领域为精密、超精密加工